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PMEG2002AESF 20 v, 0.2 a low vf mega schottky barrier rectifier 8 october 2013 product data sheet scan or click this qr code to view the latest information for this product 1. general description planar maximum efficiency general application (mega) schottky barrier rectifier with an integrated guard ring for stress protection in a dsn0603-2 (sod962-2) leadless ultra small surface-mounted device (smd) package. 2. features and benefits ? average forward current i f(av) 0.2 a ? reverse voltage v r 20 v ? low forward voltage typ. v f 245 mv ? low forward current typ. i f 10 a ? ultra small and leadless smd package ? package height typ. 0.3 mm 3. applications ? low voltage rectification ? high efficiency dc-to-dc conversion ? switch mode power supply ? low power consumption applications ? ultra high-speed switching ? led backlight for mobile application 4. quick reference data table 1. quick reference data symbol parameter conditions min typ max unit = 0.5 ; f = 20 khz; t amb = 115 c; square wave [1] - - 0.2 a i f(av) average forward current = 0.5 ; f = 20 khz; t sp = 125 c; square wave - - 0.2 a v r reverse voltage t j = 25 c - - 20 v v f forward voltage i f = 10 ma; pulsed; t p 300 s; 0.02 ; t j = 25 c - 245 310 mv i r reverse current v r = 10 v; t j = 25 c - 5 - a [1] device mounted on a ceramic printed-circuit board (pcb), al 2 o 3 , standard footprint. free datasheet http:///
nxp semiconductors PMEG2002AESF 20 v, 0.2 a low vf mega schottky barrier rectifier PMEG2002AESF all information provided in this document is subject to legal disclaimers. ? nxp n.v. 2013. all rights reserved product data sheet 8 october 2013 2 / 13 5. pinning information table 2. pinning information pin symbol description simplified outline graphic symbol 1 k cathode [1] 2 a anode transparent top view 2 1 dsn0603-2 (sod962-2) s y m 0 0 1 1 2 [1] the marking bar indicates the cathode. 6. ordering information table 3. ordering information package type number name description version PMEG2002AESF dsn0603-2 leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm sod962-2 7. marking table 4. marking codes type number marking code PMEG2002AESF a 8. limiting values table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v r reverse voltage t j = 25 c - 20 v i f forward current t sp 120 c - 0.28 a = 0.5 ; f = 20 khz; t amb = 115 c; square wave [1] - 0.2 a i f(av) average forward current = 0.5 ; f = 20 khz; t sp = 125 c; square wave - 0.2 a i frm repetitive peak forward current t p 1 ms; 0.25 - 2 a i fsm non-repetitive peak forward current t p = 8 ms; t j(init) = 25 c; square wave - 4.5 a p tot total power dissipation t amb 25 c [2] - 325 mw free datasheet http:///
nxp semiconductors PMEG2002AESF 20 v, 0.2 a low vf mega schottky barrier rectifier PMEG2002AESF all information provided in this document is subject to legal disclaimers. ? nxp n.v. 2013. all rights reserved product data sheet 8 october 2013 3 / 13 symbol parameter conditions min max unit [3] - 525 mw [1] - 950 mw t j junction temperature - 125 c t amb ambient temperature -55 125 c t stg storage temperature -65 150 c [1] device mounted on a ceramic printed-circuit board (pcb), al 2 o 3 , standard footprint. [2] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. [3] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for anode and cathode 1 cm 2 each. 9. thermal characteristics table 6. thermal characteristics symbol parameter conditions min typ max unit [1] [2] - - 310 k/w [1] [3] - - 190 k/w r th(j-a) thermal resistance from junction to ambient in free air [1] [4] - - 105 k/w r th(j-sp) thermal resistance from junction to solder point [5] - - 40 k/w [1] for schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses p r are a significant part of the total power losses. [2] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. [3] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for anode and cathode 1 cm 2 each. [4] device mounted on a ceramic pcb, al 2 o 3 , standard footprint. [5] soldering point of cathode tab. aaa-006823 t p (s) 1 0 - 3 1 0 2 1 0 3 1 0 1 1 0 - 2 1 0 - 1 1 0 2 1 0 3 z th(j-a) (k/w) 1 0 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0 0.02 0.01 fr4 pcb, standard footprint fig. 1. transient thermal impedance from junction to ambient as a function of pulse duration; typical values free datasheet http:///
nxp semiconductors PMEG2002AESF 20 v, 0.2 a low vf mega schottky barrier rectifier PMEG2002AESF all information provided in this document is subject to legal disclaimers. ? nxp n.v. 2013. all rights reserved product data sheet 8 october 2013 4 / 13 aaa-006824 t p (s) 1 0 - 3 1 0 2 1 0 3 1 0 1 1 0 - 2 1 0 - 1 1 0 2 1 0 3 z th(j-a) (k/w) 1 0 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0 fr4 pcb, mounting pad for anode and cathode 1 cm 2 each fig. 2. transient thermal impedance from junction to ambient as a function of pulse duration; typical values aaa-006825 t p (s) 1 0 - 3 1 0 2 1 0 3 1 0 1 1 0 - 2 1 0 - 1 1 0 2 z th(j-a) (k/w) 1 0 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0 ceramic pcb, al 2 o 3 , standard footprint fig. 3. transient thermal impedance from junction to ambient as a function of pulse duration; typical values free datasheet http:///
nxp semiconductors PMEG2002AESF 20 v, 0.2 a low vf mega schottky barrier rectifier PMEG2002AESF all information provided in this document is subject to legal disclaimers. ? nxp n.v. 2013. all rights reserved product data sheet 8 october 2013 5 / 13 10. characteristics table 7. characteristics symbol parameter conditions min typ max unit i f = 0.1 ma; pulsed; t p 300 s; 0.02 ; t j = 25 c - 120 180 mv i f = 1 ma; pulsed; t p 300 s; 0.02 ; t j = 25 c - 180 250 mv i f = 10 ma; pulsed; t p 300 s; 0.02 ; t j = 25 c - 245 310 mv i f = 100 ma; pulsed; t p 300 s; 0.02 ; t j = 25 c - 330 380 mv v f forward voltage i f = 200 ma; pulsed; t p 300 s; 0.02 ; t j = 25 c - 375 420 mv v r = 6 v; t j = 25 c - 3.2 20 a v r = 10 v; t j = 25 c - 5 - a i r reverse current v r = 20 v; t j = 25 c - 10 45 a v r = 1 v; f = 1 mhz; t j = 25 c - 25 - pf c d diode capacitance v r = 10 v; f = 1 mhz; t j = 25 c - 10 - pf t rr reverse recovery time i f = 200 ma; i r = 200 ma; i r(meas) = 40 ma; t j = 25 c - 1.9 - ns aaa-006875 1 0 - 2 1 0 - 3 1 1 0 - 1 1 0 i f (a) 1 0 - 4 v f (v) 0 1.0 0.8 0.4 0.6 0.2 (1) (2) (3) (4) (1) t j = 125 c (2) t j = 85 c (3) t j = 25 c (4) t j = ?40 c fig. 4. forward current as a function of forward voltage; typical values aaa-006876 1 0 - 2 1 0 - 3 1 0 - 4 1 0 - 5 1 0 - 6 1 0 - 7 1 0 - 8 i r (a) 1 0 - 9 v r (v) 0 2 0 1 5 5 1 0 (1) (2) (3) (4) (1) t j = 125 c (2) t j = 85 c (3) t j = 25 c (4) t j = ?40 c fig. 5. reverse current as a function of reverse voltage; typical values free datasheet http:///
nxp semiconductors PMEG2002AESF 20 v, 0.2 a low vf mega schottky barrier rectifier PMEG2002AESF all information provided in this document is subject to legal disclaimers. ? nxp n.v. 2013. all rights reserved product data sheet 8 october 2013 6 / 13 v r (v) 0 2 0 1 6 8 1 2 4 aaa-006877 2 0 3 0 1 0 4 0 5 0 c d (pf) 0 f = 1 mhz; t amb = 25 c fig. 6. diode capacitance as a function of reverse voltage; typical values aaa-008580 i f(a v ) (a) 0 0.3 0.2 0.1 4 0 6 0 2 0 8 0 100 p f(a v ) (mw) 0 (1) (2) (3) (4) t j = 125 c (1) = 0.1 (2) = 0.2 (3) = 0.5 (4) = 1 fig. 7. average forward power dissipation as a function of average forward current; typical values v r (v) 0 2 0 1 5 5 1 0 aaa-008581 6 0 4 0 8 0 100 p r(a v ) (mw) 0 (1) (2) (3) (4) t j = 125 c (1) = 1 (dc) (2) = 0.9; f = 20 khz (3) = 0.8; f = 20 khz (4) = 0.5; f = 20 khz fig. 8. average reverse power dissipation as a function of reverse voltage; typical values t amb (c) 0 150 100 5 0 aaa-008582 0.1 0.2 0.3 i f(a v ) (a) 0 (1) (2) (3) (4) fr4 pcb, standard footprint t j = 125 c (1) = 1 (2) = 0.5 (3) = 0.2 (4) = 0.1 fig. 9. average forward current as a function of ambient temperature; typical values free datasheet http:///
nxp semiconductors PMEG2002AESF 20 v, 0.2 a low vf mega schottky barrier rectifier PMEG2002AESF all information provided in this document is subject to legal disclaimers. ? nxp n.v. 2013. all rights reserved product data sheet 8 october 2013 7 / 13 t amb (c) 0 150 100 5 0 aaa-008583 0.1 0.2 0.3 i f(a v ) (a) 0 (1) (2) (3) (4) fr4 pcb, mounting pad for anode and cathode 1 cm 2 each t j = 125 c (1) = 1 (2) = 0.5 (3) = 0.2 (4) = 0.1 fig. 10. average forward current as a function of ambient temperature; typical values t amb (c) 0 150 100 5 0 aaa-008584 0.1 0.2 0.3 i f(a v ) (a) 0 (1) (2) (3) (4) ceramic pcb, al 2 o 3 , standard footprint t j = 125 c (1) = 1 (2) = 0.5 (3) = 0.2 (4) = 0.1 fig. 11. average forward current as a function of ambient temperature; typical values t s p (c) 0 150 100 5 0 aaa-008585 0.1 0.2 0.3 i f(a v ) (a) 0 (1) (2) (3) (4) t j = 125 c (1) = 1 (2) = 0.5 (3) = 0.2 (4) = 0.1 fig. 12. average forward current as a function of solder point temperature; typical values free datasheet http:///
nxp semiconductors PMEG2002AESF 20 v, 0.2 a low vf mega schottky barrier rectifier PMEG2002AESF all information provided in this document is subject to legal disclaimers. ? nxp n.v. 2013. all rights reserved product data sheet 8 october 2013 8 / 13 11. test information t i m e i f i r t r r i r(meas) 006aad022 fig. 13. reverse recovery definition t p t c y p t 006aac658 duty cycle = t p t c y fig. 14. duty cycle definition the current ratings for the typical waveforms are calculated according to the equations: i f(av) = i m with i m defined as peak current, i rms = i f(av) at dc, and i rms = i m ? with i rms defined as rms current. free datasheet http:///
nxp semiconductors PMEG2002AESF 20 v, 0.2 a low vf mega schottky barrier rectifier PMEG2002AESF all information provided in this document is subject to legal disclaimers. ? nxp n.v. 2013. all rights reserved product data sheet 8 october 2013 9 / 13 12. package outline references outline version european projection issue date iec jedec jeita sod962-2 sod962-2_po 13-07-12 13-07-17 unit m m max nom min 0.32 0.28 0.03 0.325 0.275 0.625 0.575 0.4 0.15 0.13 a dimensions (mm are the original dimensions) note 1. the marking bar indicates the cathode. leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm sod962-2 a 1 b 0.25 0.23 d e e 1 l 0 0.5 mm scale a a 1 e d (1) e 1 l b 1 2 fig. 15. package outline dsn0603-2 (sod962-2) free datasheet http:///
nxp semiconductors PMEG2002AESF 20 v, 0.2 a low vf mega schottky barrier rectifier PMEG2002AESF all information provided in this document is subject to legal disclaimers. ? nxp n.v. 2013. all rights reserved product data sheet 8 october 2013 10 / 13 13. soldering footprint information for reflow soldering of leadless ultra small package; 2 terminals sod962-2 sod962-2_fr solder land solder resist solder land plus solder paste solder paste deposit dimensions in mm r0.025 (8 ) 0.12 ( 2 ) 0.2 ( 2 ) 0.22 ( 2 ) 0.4 0.85 0.4 fig. 16. reflow soldering footprint for dsn0603-2 (sod962-2) 14. revision history table 8. revision history data sheet id release date data sheet status change notice supersedes PMEG2002AESF v.2 20131008 product data sheet - PMEG2002AESF v.1 modifications: ? product status changed PMEG2002AESF v.1 20130301 objective data sheet - - free datasheet http:///
nxp semiconductors PMEG2002AESF 20 v, 0.2 a low vf mega schottky barrier rectifier PMEG2002AESF all information provided in this document is subject to legal disclaimers. ? nxp n.v. 2013. all rights reserved product data sheet 8 october 2013 11 / 13 15. legal information 15.1 data sheet status document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objective specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification. [1] please consult the most recently issued document before initiating or completing a design. [2] the term 'short data sheet' is explained in section "definitions". [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest product status information is available on the internet at url http://www.nxp.com . 15.2 definitions preview the document is a preview version only. the document is still subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer, unless nxp semiconductors and customer have explicitly agreed otherwise in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 15.3 disclaimers limited warranty and liability information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - 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nxp semiconductors PMEG2002AESF 20 v, 0.2 a low vf mega schottky barrier rectifier PMEG2002AESF all information provided in this document is subject to legal disclaimers. ? nxp n.v. 2013. all rights reserved product data sheet 8 october 2013 12 / 13 grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. non-automotive qualified products unless this data sheet expressly states that this specific nxp semiconductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liability for inclusion and/or use of non- automotive qualified products in automotive equipment or applications. in the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors specifications such use shall be solely at customers own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond nxp semiconductors standard warranty and nxp semiconductors product specifications. translations a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 15.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. adelante , bitport , bitsound , coolflux , coreuse , desfire , ez-hv , fabkey , greenchip , hipersmart , hitag , i2c-bus logo, icode , i-code , itec , labelution , mifare , mifare plus , mifare ultralight , moreuse , qlpak , silicon tuner , siliconmax , smartxa , starplug , topfet , trenchmos , trimedia and ucode are trademarks of nxp b.v. hd radio and hd radio logo are trademarks of ibiquity digital corporation. free datasheet http:///
nxp semiconductors PMEG2002AESF 20 v, 0.2 a low vf mega schottky barrier rectifier PMEG2002AESF all information provided in this document is subject to legal disclaimers. ? nxp n.v. 2013. all rights reserved product data sheet 8 october 2013 13 / 13 16. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 quick reference data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 pinning information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 8 limiting values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 9 thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11 test information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 15 legal information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 15.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 15.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 ? nxp n.v. 2013. all rights reserved for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 8 october 2013 free datasheet http:///

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